Introduction to NB Module - NM1

About This Document

Applicable Scope

This document describes hardware interface specifications, electrical features, mechanical specifications, and other related in formation about the NM1 module to help you design and develop NM1 module hardware.

Purpose

This document provides NM1 module design and development bases. Through this document, you can know the NM1 module and its technical parameters and develop related functional product or devices. In addition to functional features and technical parameters, this document also describes the product reliability test, related test standards, service function implementation process, RF performance indicators, and circuit design.

Acronyms and Abbreviations

Table 1-2 Acronyms and abbreviations

Product Overview

NM1 is a compact , high performance, and low power NB IoT series module. It has the following features:

  • Supports the B1,B3, B5, B8, B20 frequency bands (B2/B23/B13/B17/B18/B19/B25/B26/B28/B66 are in developing stage).

  • Provides the SIM card interface (1.8 V), USB 1.1 interface, UART interface, SPI, I 2 C interface, and GPIO interface.

Package Dimensions

The NM1 module has 66 pins. Its dimensions is 17.7 2.4 mm (H) x 17.7 mm (W) x 15.8 mm (D).

Technical Parameters

Table 2-1 describes mechanical features, baseband features, RF features, technical standards, and environment features of the NM1 module.

Table 2-1 Technical parameters of the NM1 module

Note:

1) When the NM1 module works at a temperature within the normal operating temperature range 1 , its performance complies with 3GPP standards.

2) When the NM1 module works at a temperature within the extended operating temperature range 2 , it works properly, has the SMS* and data transmission functions, and will not have unrecoverable faults. The RF spectrum and network are not affected. Several indicators, for example, the output power, may exceed the 3GPP limits. After the operating temperature is restored to the normal operating temperature, all NM1 module indicators can meet 3GPP standard requirements.

3) A feature with an asterisk (*) is being developed.

Product Functions

Baseband Functions

The NM1 module baseband includes the USB interface signal, SIM card interface signal, I 2 C interface signal, UART interface signal, working status indicator signal, module startup and reset signals, and multiplexing control signals, power supply, and grounding of multiple GPIO interfaces.

RF Functions

Table 2-2 Working frequency bands

Note: The NM1 module is being developed to support the frequency bands with an asterisk (*).

Table2-3 Line loss requirements

Table 2-4 Antenna requirements

Note: The NM1 module is being developed to support the frequency bands with an asterisk (*).

Table 2-5 Conducted RF transmit power

Note:

1) The designed conducted RF transmit power complies with the NB IoT protocol in 3GPP Release 13 and Release 14.

2) The NM1 module is being developed to support the frequency bands with an asterisk (*).

Interfaces

Pin Definition

Pin Symbols

Table 3-1 Pin symbols

Pin Configuration Diagram

Figure 3-1 shows the NM1 module's interface pins.

Pins

Table 3-2 Interface pin definition

Electrical Conditions

Table 3-3 Electrical conditions

Power Interface

Power Pins and Grounding

The NM1 module can be powered by a battery or external power supply. The GND signal pins indicate the power ground and signal ground of the NM1 module and need to be connected to the ground of the PCB . Improper connections of the GND signal pins may have adverse impact on the NM1 module performance.

Power Supply Requirements

The NM1 module's power design is important to its performance. The NM1 module can be powered by the low dropout regulator (LDO) with low static current and output current (up to 0.5 A) or the Li MnO2 battery. The input voltage range is from 2.1 V to 3.63 V. During data transmission, the power cannot be lower than the minimum working voltage 2.1 V. Otherwise, errors will occur. To ensure better power supply performance, it is recommended that three 47 µF (0805) ceramic capacitors and100 nF, 100 pF, and 22 pF (0402) filter capacitors be connected in parallel at the VBAT input end of the module. In addition, it is recommended that a TVS tube be connected to the VBAT input end to enhance the surge voltage bearing capability of the module. In principle, a longer VBAT cable leads to a larger trace width. Figure 3 2 shows the reference circuit.

SIM Card Interface

Pins

Table 3-4 Definition and description of SIM card interface signals

SIM Card Interface Application

To ensure a better external SIM card performance and prevent the external SIM card being damaged, design the SIM card interface circuit in compliance with the following rules:

1)Place the external SIM card holder near the NM1 module. The external SIM card signal cable is 200 mm or shorter and is away from the RF cable and VBAT power cable.

2)The SIM_VDD decoupling capacitance does not exceed 1 μF, and the capacitor is near the external SIM card holder.

3)To prevent interference, keep the SIM_CLK and SIM_DATA signal cables at a certain distance from each other and use a ground cable to separate them

4)Connect the SIM_RST signal cable to the ground. To ensure a better ESD performance, you are advised to use TVS tubes to protect the pins of the external SIM card holder. The parasitic capacitance of the TVS tubes cannot be greater than 50 pF. Place ESD components near the external SIM card holder. Route the external SIM card signal cable from the external SIM card holder to the NM1 module through the ESD components.

SPIs

Pins

Table 3-7 defines the SPI signals. (SPIs support the slave mode.)

Table 3-5 SPI signal definition

SPI Electrical Parameters and application

The level of the SPI on the NM1 module is 1.8 V. If the host level is 3.3 V, add a level converter between the NM1 module and host. The level converter that supports the SPI data rate is recommended. Figure 3 4 shows the reference circuit.

I2C Interface

Pins

Table 3-6 I2C interface signal definition

I2C is a two line bus for communication between ICs. It has a serial data cable (SDA) and a serial clock cable (SCL) to transmit information between connected devices. I 2 C identifies each device based on its unique address and can be used as both a transmitter and a receiver.

I2C Interface Electrical Parameters and application

UART Interface

Pins

The NM1 module provides three UART interfaces. The primary serial interface can be used for firmware upgrade. The default baud rate is 115.2 kbit/s, and the downloading baud rate is 921.6 kbit/s. You can use a log viewing tool to view logs over the debugging serial interface to debug software.

Table 3-7 UART interface signal definition

UART Interface Electrical Parameters and application

Figure 3-6 Reference circuit

The level of the UART interfaces on the NM1 module is 1.8 V. If the application system level is 3.3 V, add a level converter to the connection between the NM1 module and application system over the serial interface. Figure 3 7 shows the reference circuit with a level converter, UM3202.

A triode can also be used for level conversion.

Note: Connection methods of the debugging, auxiliary, and primary serial interfaces are similar.

USB Interface

Pins

The NM1 module has a USB 1.1 interface, which can only be used for module upgrade. If ESD design is required, the maximum capacitance of ESD components must be less than 0.5 pF. Otherwise, waveform distortion may occur, affecting bus communication. The differential impedance of differential data cables must be within 90 ohms.

Table 3-8 USB inte rface signal definition

USB Interface Application

The nominated input power of the NM1 module is 3.3 V. When the USB interface is used for downloading, add an LDO circuit to keep t he circuit voltage at 3.3 V.

Power On/Power Off and Reset Interface

PWRKEY Pin

Table 3-9 PWRKEY signal definition

Power On/Power Off Interface application

To power on the NM1 module, lower the PWRKEY pin to a low level for a period of time and then disconnect it or raise it to a high level.

RESET Pin

To reset the NM1 module, lower the RESET pin to a low level for a period of time and then disconnect it or raise it to a high level.

RESET Interface Application

Design Instructions

This chapter provides general design guidance about the NM1 module to ensure a better product performance.

General Design Rules and Requirements

During peripheral circuit design, ensure that the external power supply have sufficient power and the differential impedance of the USB 1.1 signa l cable is within 90 ohms. Design general signal interfaces as required to match the interface signal level and prevent the NM1 module being damaged due to inconsistent levels. The NM1 module has good RF indicator performance. You need to design the antenna circuit on the PCB as required and control the impedance to prevent the RF indicators being affected.

Power Supply Circuit Design

The power supply on the PCB should supply 0.5 A or higher power to meet peak current requirements of the NM1 module. The trace width on the PCB must be large enough and form good circulation with the ground. In addition, add a large capacitor with over 1000 μF to the power supply circuit to ensure transient power supply, and control the power ripple within 100 mV.

RF Circuit Design

RF Antenna Circuit Design

It is recommended that a πtype matching circuit be reserved during RF antenna per ipheral circuit design. Ensure that the matching circuit is near the antenna, and attach resistors based on actual debugging conditions.By default, no resistor is attached to C1 and C2, and a 0 ohms resistor is attached to R1. The RF antenna peripheral circuit must have 50 ohms impedance. In the recommended RF antenna peripheral circuit layout solution, the RF cable is routed at layer 1 and the reference cable at layer 2. Use the Shortcut to Si9000 software to calculate the PCB cable impedance of the RF antenna. Figure 4 1 shows a model. During PCB cabling design, ensure that the RF reference point is complete.

During impedance calculation, specify parameters shown in Figure 4 2 and change the RF trace width to obtain the required impedance value. For typical antennas, 50 ohm impedance is recommended.

Precautions for Initial Antenna Design

Pre-project Evaluation

Ensure that the antenna is horizontal with the base station for maximum efficiency. Do not place the antenna near the power cable, data cable, or chip that may generate electromagnetic interference. Do not reserve a place for hands on the antenna to prevent attenuation caused by the human body. Consider radiation reduction and structure implementation. In the initial design phase, th e structure, ID, circuit, and antenna engineers evaluate the antenna layout together.

Antenna Matching Circuit

If a long cable exists between the RF and antenna interfaces on the NM1 module, design 50 ohms characteristics impedance for the microstrip or stripline between the RF pad and the antenna interface during PCB circuit design. In addition, reserve a matching circuit.

Suggestions on EMC and ESD Design

During overall design, consider EMC issues related to signal integrity and power integrity. During peripheral circuit cabling of the NM1 module, reserve doubled trace width between the power cable and signal cable to reduce signal coupling and ensure pure return current. During peripheral power circuit design, place the decoupling capacitor near the power pin on the NM1 module, keep high frequency and high speed circuits and sensitive circuits away from the PCB edges, and isolate the circuits from each other to reduce interference. Protect sensitive signals, and shield circuits or components on the PCB that may interfere the NM1 module. Consider ESD protection during design. Place ESD components near the key input and output signal interfaces, for example, the SIM card signal interface, to protect them. On the PCB , reasonably design mechanical p arts and PCB layout and ensure proper grounding of metal shielding covers to provide a smooth channel for static electricity discharging.

PCB Solder Pad Design

You are advised to design the middle 14 pads on the PCB based on the sizes in the structure diagram. Externally extend the 52 signal pads around the PCB to the NM1 module for over 0.3 mm, and externally extend other three sides of the pads for 0.05 mm. Use 50 ohms impedance cables for the main antenna and Wi Fi antenna.

Thermal Design

The NM1 module generates heat when it works and may be affected by other high temperature components. TheNM1 module design ensures good heat dissipation. When connecting the NM1 module to the PCB , properly connect the thermal pad to the ground to ensure thermal conduction and balance and a better electrical performance. Note:

1)Place the NM1 module away from the power supply and high speed signal cables, and protect these cables.

2)Place the antenna and the coaxial cable that is used to connect the antenna and NICPlace the antenna and the coaxial cable that is used to connect the antenna and NIC away from these away from these interference sources. interference sources.

3)Place the NM1 module away from components that generate a large amount of heat such as the CPU to prevent Place the NM1 module away from components that generate a large amount of heat such as the CPU to prevent the RF performance being affected by high temperature.the RF performance being affected by high temperature.

Production Instructions

Stencil Design

During stencil design, note the following: 1) When making the stencil of the thermal pad at the bottom of the NM1 module, reduce the stencil opening by 25% to reduce short circuits between the thermal pad and functional pins around the NM1 module. 2)To ensure better solde ring, use step stencils. 3)Use a diagonal opening for the stencil of the thermal pad. Figure 5 1 shows recommended stencil strips.

Oven Temperature Curve

The oven temperature curve has great impact on the soldering quality and material status. When the temperature rises from the ambient temperature to 150°C, the rising speed is less than 3°C per second. A temperature higher than 217°C is allowed for a maximum of 70s, and 55s is recommended. Otherwise, some components may be invalid due to strong thermal attacks, resulting in a higher defect rate and more repair difficulty. The highest temperature cannot exceed 245°C. Some materials such as the crystal may have die cracks at a high temperature. As a result, the crystal does not work and the module functions are affected. Table 5 1 describes the oven temperature curve parameter settings, and Figure 5 2 shows the oven temperature curves.

To prevent the NM1 module being damaged due to overheating, you are advised to attach the module after reflow soldering of the PCB's first side

Mechanical Dimensions

This chapter describes the mechanical dimensions of the NM1 module, in millimeters.

NM1 Module Mechanical Dimensions

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