Wi-Fi&BT Dual Mode Module
WB2S Module Datasheet
Product Overview
WB2S is a low-power embedded Wi-Fi+BLE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB2S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB2S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.
Features
Embedded low-power 32-bit CPU, which can also function as an application processor
Clock rate: 120 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)
Wi-Fi connectivity
802.11b/g/n
Channels 1 to 14 at 2.4 GHz
WPA and WPA2 security modes
Up to +16 dBm output power in 802.11b mode
EZ net pairing mode for Android and iOS devices
On-board PCB antenna with a gain of -1.0dBi
Working temperature: –20°C to +85°C
BLE Support Bluetooth (V4.0) Maximum output power + 6dBm Onboard PCB antenna
Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
ntelligent bus
Change History
Module Interfaces
Dimensions and Footprint
Interface Pin Definition
Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.
Test Pin Definition
Note: - Test pins are not recommended.
Electrical Parameters
Absolute Electrical Parameters
Electrical Conditions
RF Current Consumption
Working Current
RF Features
Basic RF Features
TX Performance
RX Performance
Antenna Information
Antenna Type
WB2S uses an onboard PCB antenna.
Antenna Interference Reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions.
Antenna Connector Specifications
WB2S does not use an antenna connector.
Packaging Information and Production Instructions
Mechanical Dimensions
Recommended PCB Layout
Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.
Production Instructions
Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves
Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%. (2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. (3) The package contains a humidity indicator card (HIC).
Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.
Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
Storage Conditions
MOQ and Packaging Information
Appendix—Statement
Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The final end product must be labeled in a visible area with the following: "Contains Transmitter Module2AFNL-BR3L" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.
This LMA does not have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.
Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.
EN 300 328 V2.1.1
EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1
EN 62311:2008
EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
WB1S Module Datasheet
Product Overview
WB1S is a low-power embedded Wi-Fi+BLE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB1S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.
Features
Embedded low-power 32-bit CPU, which can also function as an application processor
Clock rate: 120 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)
Wi-Fi connectivity
802.11b/g/n
Channels 1 to 14 at 2.4 GHz
WPA and WPA2 security modes
Up to +16 dBm output power in 802.11b mode
EZ net pairing mode for Android and iOS devices
On-board PCB antenna
Working temperature: –20°C to +85°C
BLE Support Bluetooth (V4.0) Maximum output power + 6dBm On-board PCB antenna and external antenna IPEX connector
Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
ntelligent bus
Change History
Module Interfaces
Dimensions and Footprint
WB1S has two rows of pins with a 2 mm pin spacing. The WB1S dimensions (H x W x D) are 2.8 mm x 16 mm x 23.5 mm. Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.
Interface Pin Definition
Note: - P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. - CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration.
Test Pin Definition
Note: - Test pins are not recommended.
Electrical Parameters
Absolute Electrical Parameters
Electrical Conditions
RF Current Consumption
Working Current
RF Features
Basic RF Features
TX Performance
RX Performance
Antenna Information
Antenna Type
The default method is a PCB onboard antenna
Antenna Interference Reduction
Antenna Connector Specifications
Packaging Information and Production Instructions
Mechanical Dimensions
Recommended PCB Layout
Production Instructions
Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves
Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.
Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
Storage Conditions
MOQ and Packaging Information
Appendix—Statement
Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The final end product must be labeled in a visible area with the following: "Contains Transmitter Module2AFNL-BR3L" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.
This LMA does not have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.
Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.
EN 300 328 V2.1.1
EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1
EN 62311:2008
EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
WB3S Module Datasheet
Product Overview
WB3S is a low-power embedded Wi-Fi+BLE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.
Features
Embedded low-power 32-bit CPU, which can also function as an application processor
Clock rate: 120 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)
Wi-Fi connectivity
802.11b/g/n
Channels 1 to 14 at 2.4 GHz
WPA and WPA2 security modes
Up to +16 dBm output power in 802.11b mode
EZ net pairing mode for Android and iOS devices O- nboard PCB antenna with a gain of 2.3 dBi
Working temperature: –20°C to +85°C
BLE Support Bluetooth (V4.0) Maximum output power + 6dBm Onboard PCB antenna with a gain of 1.5 dBi
Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
ntelligent bus
Change History
Module Interfaces
Dimensions and Footprint
Interface Pin Definition
Note: - P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. - CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration. - UART1 is a user-side serial interface pin, which generates information when the module is powered on and starts.
Test Pin Definition
Note: - Test pins are not recommended.
Electrical Parameters
Absolute Electrical Parameters
Electrical Conditions
RF Current Consumption
Working Current
RF Features
Basic RF Features
TX Performance
RX Performance
Antenna Information
Antenna Type
WB3S uses an onboard PCB antenna.
Antenna Interference Reduction
Antenna Connector Specifications
WB3S does not use an antenna connector.
Packaging Information and Production Instructions
Mechanical Dimensions
Recommended PCB Layout
Production Instructions
Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves
Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.
Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
Storage Conditions
MOQ and Packaging Information
Appendix—Statement
Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The final end product must be labeled in a visible area with the following: "Contains Transmitter Module2AFNL-BR3L" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.
This LMA does not have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.
Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.
EN 300 328 V2.1.1
EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1
EN 62311:2008
EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013
WB3L Module Datasheet
Product Overview
WB3L is a low-power embedded Wi-Fi and BLE module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3L is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals. WB3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC andTCP/IP protocols. You can develop embedded Wi-Fi products as required.
Features
Embedded low-power 32-bit CPU, which can also function as an application processor
Dominant frequency: 120 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: 8 GPIOs
Wi-Fi connectivity
802.11 b/g/n
Channels 1 to 14 at 2.4 GHz
WPA and WPA2 security modes
Up to +17 dBm output power in 802.11b mode
STA, AP, and STA+AP working modes
EZ and AP net pairing modes for Android and iOS devices
Onboard PCB antenna with a gain of 1.2 dBi
Working temperature: –40°C to +105°C
BLE connectivity
Support for Bluetooth 4.0
Maximum output power of +6 dBm
Onboard PCB antenna with a gain of 1.2 dBi
Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus
Change History
Module Interfaces
Dimensions and Footprint
WB3L has two rows of pins with a 2±0.1 mm pin spacing.
The WB3L dimensions (H x W x D) are 2.8±0.15 mm x 16±0.35 mm x 24±0.35 mm. Figure shows the WB3L front and rear views.
Interface Pin Definition
Note：P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.
Test Pin Definition
Electrical Parameters
Absolute Electrical Parameters
Working Conditions
Current consumption during constant transmission and receiving
Working Current
RF Features
Basic RF Features
TX Performance
Performance during constant transmission
RX Performance
RX sensitivity
Antenna Information
Antenna Type
WB3L uses an onboard PCB antenna.
Antenna Interference Reduction
Packaging Information and Production Instructions
Mechanical Dimensions
The PCB dimensions (W x L x H) are 16±0.35mm (W)×24±0.35mm (L) ×2.8±0.15mm (H)。
Side view
Recommended Schematic Encapsulation
Recommended PCB Encapsulation-Pin header
WB3L can be mounted onto a PCB by using an SMT placement machine or through-hole mounted onto the PCB through a pin header.
Recommended PCB Encapsulation-SMT
Production Instructions
Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. A.SMT placement equipment： a)Reflow soldering machine； b)Automated optical inspection (AOI) equipment； c)Nozzle with a 6 mm to 8 mm diameter； B. Baking equipment： a)Cabinet oven； b)Anti-static heat-resistant trays； c)Anti-static heat-resistant gloves；
Bake a module based on HIC status as follows when you unpack the module package: A.If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. B. If the 30% circle is pink, bake the module for 4 consecutive hours. C.If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. D.If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
Baking settings: A.Baking temperature：125±5℃； B.Alarm temperature：130℃； C.SMT placement ready temperature after natural cooling: < 36°C； D.Number of drying times: 1； E.Rebaking condition: The module is not soldered within 12 hours after baking. 5.Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.
Storage Conditions
MOQ and Packing Information
Appendix: Statement
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.
Important Note
This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
This device have got a FCC ID：2ANDL-WB3L.The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB3L”
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com
This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead，it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
WBLC5 Module Datasheet
Product Overview
WBLC5 is a low-power embedded Wi-Fi and BLE module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3L is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals. WBLC5 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC andTCP/IP protocols. You can develop embedded Wi-Fi products as required.
Features
Embedded low-power 32-bit CPU, which can also function as an application processor
Dominant frequency: 120 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: 3 GPIOs
Wi-Fi connectivity
802.11 b/g/n
Channels 1 to 14 at 2.4 GHz
WPA and WPA2 security modes
Up to +17 dBm output power in 802.11b mode
STA, AP, and STA+AP working modes
EZ and AP net pairing modes for Android and iOS devices
Monopole antenna with a gain of 4.6 dBi
Working temperature: –40°C to +105°C
BLE connectivity
Support for Bluetooth 4.0
Maximum output power of +6 dBm
Monopole antenna with a gain of 4.6 dBi
Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus
Change History
Module Interfaces
Dimensions and Footprint
WB3L has two rows of pins with a 2±0.1 mm pin spacing. The WB3L dimensions (W x L x H) are 8.5±0.35mm (W)×12.7±0.35mm (L) ×1±0.15mm (H)。
Interface Pin Definition
Note：P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.
Test Pin Definition
Note：The test pin is not recommended to use.
Electrical Parameters
Absolute Electrical Parameters
Working Conditions
Current consumption during constant transmission and receiving
Working Current
RF Features
Basic RF Features
TX Performance
Performance during constant transmission
RX Performance
RX sensitivity
Antenna Information
Antenna Type
WBLC5 uses a monopole antenna.
Antenna Interference Reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses a monopole antenna, it is recommended that the antenna be at least 15mm away from other metal parts.
Packaging Information and Production Instructions
Mechanical Dimensions
The PCB dimensions：8.5±0.35mm (W)×12.7±0.35mm (L) ×1±0.15mm (H)。
Recommended PCB Encapsulation-Pin header
WBLC5 module is inserted and welded。
Production Instructions
Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. A.SMT placement equipment： a)Reflow soldering machine； b)Automated optical inspection (AOI) equipment； c)Nozzle with a 6 mm to 8 mm diameter； B. Baking equipment： a)Cabinet oven； b)Anti-static heat-resistant trays； c)Anti-static heat-resistant gloves；
Bake a module based on HIC status as follows when you unpack the module package: A.If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. B. If the 30% circle is pink, bake the module for 4 consecutive hours. C.If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. D.If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
Baking settings: A.Baking temperature：125±5℃； B.Alarm temperature：130℃； C.SMT placement ready temperature after natural cooling: < 36°C； D.Number of drying times: 1； E.Rebaking condition: The module is not soldered within 12 hours after baking. 5.Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
Before SMT placement, take electrostatic discharge (ESD) protective measures.
To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.
Recommended Oven Temperature Curve
Please insert the parts according to the reflow welding curve.Peak temperature is 245℃：
Storage Conditions
MOQ and Packing Information
Appendix: Statement
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.
Important Note
This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
The RF module is considered as a limited modular transmitter according to FCC rules.Even though the RF module get a FCC ID, the host product manufacturer can not use the FCC ID on the final product directly.In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.
Declaration of Conformity European notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com
This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead，it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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