Wi-Fi&BT Dual Mode Module

WB2S Module Datasheet

Product Overview

WB2S is a low-power embedded Wi-Fi+BLE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB2S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB2S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor

  • Clock rate: 120 MHz

  • Working voltage: 3.0 V to 3.6 V

  • Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)

  • Wi-Fi connectivity

  • 802.11b/g/n

  • Channels 1 to 14 at 2.4 GHz

  • WPA and WPA2 security modes

  • Up to +16 dBm output power in 802.11b mode

  • EZ net pairing mode for Android and iOS devices

  • On-board PCB antenna with a gain of -1.0dBi

  • Working temperature: –20°C to +85°C

  • BLE Support Bluetooth (V4.0) Maximum output power + 6dBm Onboard PCB antenna

Applications

  • Intelligent building

  • Smart household and home appliances

  • Smart socket and light

  • Industrial wireless control

  • Baby monitor

  • Network camera

  • ntelligent bus

Change History

No.

Date

Change Description

Version After Change

1

2019-11-22

This is the first release.

1.0.0

Module Interfaces

Dimensions and Footprint

Interface Pin Definition

Pin No.

Symbol

I/O Type

Function

1

VBAT

P

Power supply pin (3.3 V), which is connected to the VBAT pin on the internal IC

2

PWM2

I/O

Common GPIO, which is connected to the P8 pin on the internal IC

3

GND

P

Power supply reference ground pin

4

PWM1

I/O

Common GPIO, which is connected to the P7 pin on the internal IC

5

1RX

I/O

UART1_RXD, which is used as a user-side serial interface pin and is connected to the P10 pin on the internal IC

6

PWM0

I/O

Common GPIO, which is connected to the P6 pin on the internal IC

7

1TX

I/O

UART1_TXD, which is used as a user-side serial interface pin and is connected to the P11 pin on the internal IC

8

AD

AI

ADC pin, which is connected to the P23 pin on the internal IC

9

PWM4

I/O

Common GPIO, which is connected to the P24 pin on the internal IC

10

CEN

I

Low-level reset, high-level active (internally pulled high) Docking IC-CEN

11

PWM5

I/O

Common GPIO, which is connected to the P26 pin on the internal IC

Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.

Test Pin Definition

Pin No.

Symbol

I/O Type

Function

1

SO

I/O

Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning andis connected to the P23 or ADC3 pin on the internal IC

2

SI

I/O

Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning andis connected to the P22 pin on the internal IC

3

CS

I/O

Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and isconnected to the P21 pin on the internal IC

4

SCK

I/O

Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC

Note: - Test pins are not recommended.

Electrical Parameters

Absolute Electrical Parameters

Parameter

Description

Minimum Value

Maximum Value

Unit

Ts

Storage temperature

–40

150

°C

VCC

Power supply voltage

–0.3

3.6

V

Static electricity voltage (human body model)

Tamb = 25°C

N/A

2

kV

Static electricity voltage (machine model)

Tamb = 25°C

N/A

0.5

kV

Electrical Conditions

Parameter

Description

Minimum Value

Typical Value

Maximum Value

Unit

Ta

Working temperature

–20

N/A

85

°C

VCC

Power supply voltage

3.0

3.3

3.6

V

VIL

I/O low-level input

–0.3

N/A

VCC x 0.25

V

VIH

I/Ohigh-level input

VCC x 0.75

N/A

3.6

V

VOL

I/O low-level output

N/A

N/A

VCC x 0.1

V

VoH

I/O high-level output

VCC x 0.8

N/A

VCC

V

Imax

I/O drive current

N/A

6

15

mA

RF Current Consumption

Working Status

Mode

Rate

TX Power / Receiving

Typical Value

Unit

TX

802.11b

11 Mbit/s

+16 dBm

235

mA

802.11g

54 Mbit/s

+14 dBm

200

mA

802.11n

MCS7

+12 dBm

185

mA

802.11n HT40

MCS7

+12 dBm

190

mA

RX

802.11b

11 Mbit/s

Constant receiving

98

mA

802.11g

54 Mbit/s

Constant receiving

98

mA

802.11n

MCS7

Constant receiving

98

mA

802.11n HT40

MCS7

Constant receiving

116

mA

Working Current

Working Mode

Working Status (Ta = 25°C)

Average Value

Peak Value*(Typical Value)

Unit

Quick connection network status (Bluetooth network)

The module is in the fast network configuration state, and the WIFI indicator flashes quickly

110

310

mA

Fast connection network status (AP network configuration)

The module is in the fast connection network configuration state, the WIFI indicator flashes slowly

80

430

mA

Quick Connect Network Status (EZ Network)

The module is in the fast network configuration state, and the WIFI indicator flashes quickly

80

320

mA

Network connection idle state

The module is connected to the network and the WiFi indicator is always on

50

300

mA

Network connection operation status

The module is connected to the network and the WiFi indicator is always on

50

315

mA

Disconnected status

Module is offline

105

315

mA

RF Features

Basic RF Features

Parameter

Description

Frequency band

2.412 GHz to 2.484 GHz

Wi-Fi standard

IEEE 802.11b/g/n (channels 1 to 14)

BLE standard

BLE 4.0

Data transmission rate

802.11b: 1, 2, 5.5, or 11 (Mbit/s)

802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)

802.11n: HT20 MCS0 to MCS7

802.11n: HT40 MCS0 to MCS7

Antenna type

Onboard PCB antenna with a gain of -1 dBi

TX Performance

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

Average RF output power, 802.11b CCK mode 11 Mbit/s

N/A

16

N/A

dBm

Average RF output power, 802.11g OFDM mode 54 Mbit/s

N/A

14

N/A

dBm

Average RF output power, 802.11n OFDM mode MCS7

N/A

13

N/A

dBm

Frequency error

–2

N/A

+2

ppm

EVM under 802.11b CCK, 11 Mbit/s 16 dBm

NA

–18

NA

dB

EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm

–26

–27

–29

dB

EVM under 802.11n OFDM, MCS7, 13 dBm

–26

–27

–28

dB

RX Performance

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

PER < 8%, 802.11b CCK mode 1 Mbit/s

N/A

–85

N/A

dBm

PER < 10%, 802.11g OFDM mode 54 Mbit/s

N/A

–72

N/A

dBm

PER < 10%, 802.11n OFDM mode MCS7

N/A

–68

N/A

dBm

PER < 10%,BLE 1M

NA

–95

NA

dBm

Antenna Information

Antenna Type

WB2S uses an onboard PCB antenna.

Antenna Interference Reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions.

Antenna Connector Specifications

WB2S does not use an antenna connector.

Packaging Information and Production Instructions

Mechanical Dimensions

Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Production Instructions

  1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves

  2. Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%. (2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. (3) The package contains a humidity indicator card (HIC).

  3. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

  4. Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.

  5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

  6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.

Storage Conditions

MOQ and Packaging Information

Product number

MOQ(pcs)

Shipping packaging method

Modules per reel (pcs)

Packaging reels per box (reels)

WB2S

4000

Tape reel

1000

4

Appendix—Statement

Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The final end product must be labeled in a visible area with the following: "Contains Transmitter Module2AFNL-BR3L" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.

This LMA does not have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.

Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.

EN 300 328 V2.1.1

EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1

EN 62311:2008

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

WB1S Module Datasheet

Product Overview

WB1S is a low-power embedded Wi-Fi+BLE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB1S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor

  • Clock rate: 120 MHz

  • Working voltage: 3.0 V to 3.6 V

  • Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)

  • Wi-Fi connectivity

  • 802.11b/g/n

  • Channels 1 to 14 at 2.4 GHz

  • WPA and WPA2 security modes

  • Up to +16 dBm output power in 802.11b mode

  • EZ net pairing mode for Android and iOS devices

  • On-board PCB antenna

  • Working temperature: –20°C to +85°C

  • BLE Support Bluetooth (V4.0) Maximum output power + 6dBm On-board PCB antenna and external antenna IPEX connector

Applications

  • Intelligent building

  • Smart household and home appliances

  • Smart socket and light

  • Industrial wireless control

  • Baby monitor

  • Network camera

  • ntelligent bus

Change History

No.

Date

Change Description

Version After Change

1

2019-11-22

This is the first release.

1.0.0

Module Interfaces

Dimensions and Footprint

WB1S has two rows of pins with a 2 mm pin spacing. The WB1S dimensions (H x W x D) are 2.8 mm x 16 mm x 23.5 mm. Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Interface Pin Definition

Pin No.

Symbol

I/O Type

Function

1

VCC

P

Power supply pin (3.3 V)

2

TXD1

I/O

UART1_TXD, which is used as a user-side serial interface pin and connected to the P11 pin on the internal IC

3

RXD1

I/O

UART1_RXD, which is used as a user-side serial interface pin and connected to the P10 pin on the internal IC

4

3V3

P

Power supply pin (3.3 V)

5

GND

P

Power supply reference ground pin

6

P26

I/O

Common I/O pin, which can be used as a hardware PWM pin and is connected to the P26 pin on the internal IC

7

P24

I/O

Common I/O pin, which can be used as a hardware PWM pin and is connected to the P24 pin on the internal IC

8

TXD2

I/O

UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC

9

P8

I/O

Common I/O pin, which can be used as a hardware PWM pin and is connected to the P8 pin on the internal IC

10

P7

I/O

Common I/O pin, which can be used as a hardware PWM pin and is connected to the P7 pin on the internal IC

11

RXD2

I/O

UART0_RXD, which is used for displaying the module internal information and is connected to the P1 pin on the internal IC

12

P9

I/O

Common I/O pin, which can be used as a hardware PWM pin and is connected to the P9 pin on the internal IC

13

P6

I/O

Common I/O pin, which can be used as a hardware PWM pin and is connected to the P6 pin on the internal IC

14

GND

P

Power supply reference ground pin

15

GND

P

Power supply reference ground pin

16

CEN

I

Low-level reset, high-level active (internally pulled high) Docking IC-CEN

17

ADC3

AI

ADC pin, which is connected to the P23 pin on the internal IC

18

GND

P

Power supply reference ground pin

Note: - P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. - CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration.

Test Pin Definition

Pin No.

Symbol

I/O Type

Function

1

SO

I/O

Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning andis connected to the P23 or ADC3 pin on the internal IC

2

SI

I/O

Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning andis connected to the P22 pin on the internal IC

3

CS

I/O

Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and isconnected to the P21 pin on the internal IC

4

SCK

I/O

Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC

Note: - Test pins are not recommended.

Electrical Parameters

Absolute Electrical Parameters

Parameter

Description

Minimum Value

Maximum Value

Unit

Ts

Storage temperature

–40

150

°C

VCC

Power supply voltage

–0.3

3.6

V

Static electricity voltage (human body model)

Tamb = 25°C

N/A

2

kV

Static electricity voltage (machine model)

Tamb = 25°C

N/A

0.5

kV

Electrical Conditions

Parameter

Description

Minimum Value

Typical Value

Maximum Value

Unit

Ta

Working temperature

–20

N/A

85

°C

VCC

Power supply voltage

3.0

3.3

3.6

V

VIL

I/O low-level input

–0.3

N/A

VCC x 0.25

V

VIH

I/Ohigh-level input

VCC x 0.75

N/A

3.6

V

VOL

I/O low-level output

N/A

N/A

VCC x 0.1

V

VoH

I/O high-level output

VCC x 0.8

N/A

VCC

V

Imax

I/O drive current

N/A

6

15

mA

RF Current Consumption

Working Status

Mode

Rate

TX Power / Receiving

Typical Value

Unit

TX

802.11b

11 Mbit/s

+16 dBm

222

mA

802.11g

54 Mbit/s

+14 dBm

195

mA

802.11n

MCS7

+12 dBm

185

mA

802.11n HT40

MCS7

+12 dBm

190

mA

RX

802.11b

11 Mbit/s

Constant receiving

98

mA

802.11g

54 Mbit/s

Constant receiving

98

mA

802.11n

MCS7

Constant receiving

98

mA

802.11n HT40

MCS7

Constant receiving

116

mA

Working Current

Working Mode

Working Status (Ta = 25°C)

Average Value

Peak Value*(Typical Value)

Unit

Quick connection network status (Bluetooth network)

The module is in the fast network configuration state, and the WIFI indicator flashes quickly

100

260

mA

Fast connection network status (AP network configuration)

The module is in the fast connection network configuration state, the WIFI indicator flashes slowly

80

360

mA

Quick Connect Network Status (EZ Network)

The module is in the fast network configuration state, and the WIFI indicator flashes quickly

80

320

mA

Network connection idle state

The module is connected to the network and the WiFi indicator is always on

50

250

mA

Network connection operation status

The module is connected to the network and the WiFi indicator is always on

60

260

mA

Disconnected status

Module is offline

105

250

mA

RF Features

Basic RF Features

Parameter

Description

Frequency band

2.412 GHz to 2.484 GHz

Wi-Fi standard

IEEE 802.11b/g/n (channels 1 to 14)

BLE standard

BLE 4.0

Data transmission rate

802.11b: 1, 2, 5.5, or 11 (Mbit/s)

802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)

802.11n: HT20 MCS0 to MCS7

802.11n: HT40 MCS0 to MCS7

Antenna type

Onboard PCB antenna with a gain of 0.5 dBi

TX Performance

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

Average RF output power, 802.11b CCK mode 11 Mbit/s

N/A

16

N/A

dBm

Average RF output power, 802.11g OFDM mode 54 Mbit/s

N/A

14

N/A

dBm

Average RF output power, 802.11n OFDM mode MCS7

N/A

13

N/A

dBm

Frequency error

–2

N/A

+2

ppm

EVM under 802.11b CCK, 11 Mbit/s 16 dBm

–18

dB

EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm

–30

–29

–25

dB

EVM under 802.11n OFDM, MCS7, 13 dBm

–31

–28

–27

dB

RX Performance

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

PER < 8%, 802.11b CCK mode 1 Mbit/s

N/A

–92

N/A

dBm

PER < 10%, 802.11g OFDM mode 54 Mbit/s

N/A

–75

N/A

dBm

PER < 10%, 802.11n OFDM mode MCS7

N/A

–68

N/A

dBm

PER < 10%,BLE 1M

NA

–95

NA

dBm

Antenna Information

Antenna Type

The default method is a PCB onboard antenna

Antenna Interference Reduction

Antenna Connector Specifications

Packaging Information and Production Instructions

Mechanical Dimensions

Production Instructions

  1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves

  2. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

  3. Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.

  4. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

  5. Before SMT placement, take electrostatic discharge (ESD) protective measures.

  6. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.

Storage Conditions

MOQ and Packaging Information

Product number

MOQ(pcs)

Shipping packaging method

Modules per reel (pcs)

Packaging reels per box (reels)

WB1S

4000

Tape reel

1000

4

Appendix—Statement

Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The final end product must be labeled in a visible area with the following: "Contains Transmitter Module2AFNL-BR3L" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.

This LMA does not have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.

Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.

EN 300 328 V2.1.1

EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1

EN 62311:2008

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

WB3S Module Datasheet

Product Overview

WB3S is a low-power embedded Wi-Fi+BLE Dual protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WB3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor

  • Clock rate: 120 MHz

  • Working voltage: 3.0 V to 3.6 V

  • Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)

  • Wi-Fi connectivity

  • 802.11b/g/n

  • Channels 1 to 14 at 2.4 GHz

  • WPA and WPA2 security modes

  • Up to +16 dBm output power in 802.11b mode

  • EZ net pairing mode for Android and iOS devices O- nboard PCB antenna with a gain of 2.3 dBi

  • Working temperature: –20°C to +85°C

  • BLE Support Bluetooth (V4.0) Maximum output power + 6dBm Onboard PCB antenna with a gain of 1.5 dBi

Applications

  • Intelligent building

  • Smart household and home appliances

  • Smart socket and light

  • Industrial wireless control

  • Baby monitor

  • Network camera

  • ntelligent bus

Change History

No.

Date

Change Description

Version After Change

1

2019-11-22

This is the first release.

1.0.0

Module Interfaces

Dimensions and Footprint

Interface Pin Definition

Pin No.

Symbol

I/O Type

Function

1

CEN

I

Low-level reset, high-level active (internally pulled high) Docking IC-CEN

2

ADC3

AI

ADC pin, which is connected to the P23 pin on the internal IC

3

EN

Input

Enabling pin, which is internally pulled up and compatible with other module design

4

P14

I/O

Common GPIO, which is connected to the P14 pin on the internal IC

5

PWM5

I/O

GPIOP_26, which is connected to the P26 pin on the internal IC

6

PWM4

I/O

GPIOP_24, common GPIO, which is connected to the P24 pin on the internal IC

7

PWM0

I/O

GPIOP_6, which is connected to the P6 pin on the internal IC

8

VCC

P

Power supply pin (3.3 V)

9

GND

P

Power supply reference ground pin

10

PWM1

I/O

GPIOP_7, which is connected to the P7 pin on the internal IC

11

TXD2

I/O

UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC

12

RXD2

I/O

UART0_RXD, which is used to display the module internal information and connected to the P1 pin on the internal IC

13

PWM3

I/O

GPIOP_9, common GPIO, which is connected to the P9 pin on the internal IC

14

PWM2

I/O

GPIOP_8, which is connected to the P8 pin on the internal IC

15

RXD1

I/O

UART1_RXD, which is used as a user-side serial interface pin and is connected to the P10 pin on the internal IC

16

TXD1

I/O

UART1_TXD, which is used as a user-side serial interface pin and is connected to the P11 pin on the internal IC

Note: - P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. - CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration. - UART1 is a user-side serial interface pin, which generates information when the module is powered on and starts.

Test Pin Definition

Pin No.

Symbol

I/O Type

Function

1

SO

I/O

Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning andis connected to the P23 or ADC3 pin on the internal IC

2

SI

I/O

Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning andis connected to the P22 pin on the internal IC

3

CS

I/O

Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and isconnected to the P21 pin on the internal IC

4

SCK

I/O

Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC

Note: - Test pins are not recommended.

Electrical Parameters

Absolute Electrical Parameters

Parameter

Description

Minimum Value

Maximum Value

Unit

Ts

Storage temperature

–40

150

°C

VCC

Power supply voltage

–0.3

3.6

V

Static electricity voltage (human body model)

Tamb = 25°C

N/A

2

kV

Static electricity voltage (machine model)

Tamb = 25°C

N/A

0.5

kV

Electrical Conditions

Parameter

Description

Minimum Value

Typical Value

Maximum Value

Unit

Ta

Working temperature

–20

N/A

85

°C

VCC

Power supply voltage

3.0

3.3

3.6

V

VIL

I/O low-level input

–0.3

N/A

VCC x 0.25

V

VIH

I/Ohigh-level input

VCC x 0.75

N/A

3.6

V

VOL

I/O low-level output

N/A

N/A

VCC x 0.1

V

VoH

I/O high-level output

VCC x 0.8

N/A

VCC

V

Imax

I/O drive current

N/A

6

15

mA

RF Current Consumption

Working Status

Mode

Rate

TX Power / Receiving

Typical Value

Unit

TX

802.11b

11 Mbit/s

+16 dBm

222

mA

802.11g

54 Mbit/s

+14 dBm

195

mA

802.11n HT20

MCS7

+12 dBm

185

mA

802.11n HT40

MCS7

+12 dBm

190

mA

RX

802.11b

11 Mbit/s

Constant receiving

98

mA

802.11g

54 Mbit/s

Constant receiving

98

mA

802.11n HT20

MCS7

Constant receiving

98

mA

802.11n HT40

MCS7

Constant receiving

116

mA

Working Current

Working Mode

Working Status (Ta = 25°C)

Average Value

Peak Value*(Typical Value)

Unit

Quick connection network status (Bluetooth network)

The module is in the fast network configuration state, and the WIFI indicator flashes quickly

100

260

mA

Fast connection network status (AP network configuration)

The module is in the fast connection network configuration state, the WIFI indicator flashes slowly

70

305

mA

Quick Connect Network Status (EZ Network)

The module is in the fast network configuration state, and the WIFI indicator flashes quickly

60

300

mA

Network connection idle state

The module is connected to the network and the WiFi indicator is always on

40

270

mA

Network connection operation status

The module is connected to the network and the WiFi indicator is always on

50

280

mA

Disconnected status

Module is offline

100

260

mA

RF Features

Basic RF Features

Parameter

Description

Frequency band

2.412 GHz to 2.484 GHz

Wi-Fi standard

IEEE 802.11b/g/n (channels 1 to 14)

BLE standard

BLE 4.0

Data transmission rate

802.11b: 1, 2, 5.5, or 11 (Mbit/s)

802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)

802.11n: HT20 MCS0 to MCS7

802.11n: HT40 MCS0 to MCS7

Antenna type

Onboard PCB antenna with a gain of 2.3 dBi

TX Performance

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

Average RF output power, 802.11b CCK mode 11 Mbit/s

N/A

16

N/A

dBm

Average RF output power, 802.11g OFDM mode 54 Mbit/s

N/A

14

N/A

dBm

Average RF output power, 802.11n OFDM mode MCS7

N/A

13

N/A

dBm

Frequency error

–2

N/A

+2

ppm

EVM under 802.11b CCK, 11 Mbit/s 16 dBm

–18

dB

EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm

–26

–27

–29

dB

EVM under 802.11n OFDM, MCS7, 13 dBm

–26

–27

–29

dB

RX Performance

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

PER < 8%, 802.11b CCK mode 1 Mbit/s

N/A

–92

N/A

dBm

PER < 10%, 802.11g OFDM mode 54 Mbit/s

N/A

–75

N/A

dBm

PER < 10%, 802.11n OFDM mode MCS7

N/A

–68

N/A

dBm

PER < 10%,BLE 1M

NA

–95

NA

dBm

Antenna Information

Antenna Type

WB3S uses an onboard PCB antenna.

Antenna Interference Reduction

Antenna Connector Specifications

WB3S does not use an antenna connector.

Packaging Information and Production Instructions

Mechanical Dimensions

Production Instructions

  1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves

  2. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

  3. Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.

  4. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

  5. Before SMT placement, take electrostatic discharge (ESD) protective measures.

  6. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.

Storage Conditions

MOQ and Packaging Information

Product number

MOQ(pcs)

Shipping packaging method

Modules per reel (pcs)

Packaging reels per box (reels)

WB3S

4000

Tape reel

1000

4

Appendix—Statement

Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: —Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands is country dependent and firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The final end product must be labeled in a visible area with the following: "Contains Transmitter Module2AFNL-BR3L" This radio module must not be installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio.

This LMA does not have RF shielding and is tested and approved as standalone configuration, additional evaluation may be required for any system integrated this radio module.

Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that this Wi-Fi module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EC. A copy of the Declaration of conformity can be found at https://www.tuya.com.

EN 300 328 V2.1.1

EN 301 489-1 V2.1.1; EN 301 489-17 V3.1.1

EN 62311:2008

EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

WB3L Module Datasheet

Product Overview

WB3L is a low-power embedded Wi-Fi and BLE module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3L is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals. WB3L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC andTCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor

  • Dominant frequency: 120 MHz

  • Working voltage: 3.0 V to 3.6 V

  • Peripherals: 8 GPIOs

  • Wi-Fi connectivity

    • 802.11 b/g/n

    • Channels 1 to 14 at 2.4 GHz

    • WPA and WPA2 security modes

    • Up to +17 dBm output power in 802.11b mode

    • STA, AP, and STA+AP working modes

    • EZ and AP net pairing modes for Android and iOS devices

    • Onboard PCB antenna with a gain of 1.2 dBi

    • Working temperature: –40°C to +105°C

  • BLE connectivity

    • Support for Bluetooth 4.0

    • Maximum output power of +6 dBm

    • Onboard PCB antenna with a gain of 1.2 dBi

Applications

  • Intelligent building

  • Smart household and home appliances

  • Smart socket and light

  • Industrial wireless control

  • Baby monitor

  • Network camera

  • Intelligent bus

Change History

No.

Date

Change Description

Version After Change

1

2019-11-17

This is the first release.

V1.0.0

Module Interfaces

Dimensions and Footprint

WB3L has two rows of pins with a 2±0.1 mm pin spacing.

The WB3L dimensions (H x W x D) are 2.8±0.15 mm x 16±0.35 mm x 24±0.35 mm. Figure shows the WB3L front and rear views.

Interface Pin Definition

Pin No.

Symbol

I/O Type

Function

1

RST

I/O

Reset pin, which is disconnected

2

ADC

AI

ADC pin, which is connected to the P23 pin on the internal IC

3

EN

I

Module enabling pin, which is connected to 3.3 V for normal use

4

P14

I/O

Common I/O pin, which is connected to the P14 pin on the internal IC

5

PWM5

I/O

Hardware PWM pin, which is connected to the P26 pin on the internal IC

6

PWM4

I/O

Hardware PWM pin, which is connected to the P24 pin on the internal IC

7

PWM0

I/O

Hardware PWM pin, which is connected to the P6 pin on the internal IC

8

VCC

P

Power supply pin (3.3 V)

9

GND

P

Ground pin

10

PWM3

I/O

Hardware PWM pin, which is connected to the P9 pin on the internal IC

11

TXD2

I/O

UART2_TX, which is connected to the P0 pin on the internal IC

12

P16

I/O

Common I/O pin, which is connected to the P16 pin on the internal IC

13

PWM2

I/O

Hardware PWM pin, which is connected to the P8 pin on the internal IC

14

PWM1

I/O

Hardware PWM pin, which is connected to the P7 pin on the internal IC

15

RXD1

I/O

Serial interface receiving pin (UART_RX), which is connected to the P10 pin on the internal IC

16

TXD1

I/O

Serial interface transmission pin (UART_TX), which is connected to the P11 pin on the internal IC

Note:P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.

Test Pin Definition

Pin No.

Symbol

I/O Type

Function

TP6

U2_RXD

I/O

UART2_RX, which is connected to the P1 pin on the internal IC

TP2

F_SCK

I/O

Clock pin when data is downloaded from the flash memory, which is connected to the P20 pin on the internal IC

TP3

F_CSN

I/O

Command enabling pin when data is downloaded from the flash memory, which is connected to the P21 pin on the internal IC

TP5

F_SO

I/O

Data input pin when data is downloaded from the flash memory, which is connected to the P22 pin on the internal IC

Electrical Parameters

Absolute Electrical Parameters

Parameter

Description

Minimum Value

Maximum Value

Unit

Ts

Storage temperature

-40

105

VBAT

Power supply voltage

3.0

3.6

V

Static electricity voltage (human body model)

TAMB-25℃

-

2

KV

Static electricity voltage (machine model)

TAMB-25℃

-

0.5

KV

Working Conditions

Parameter

Description

Minimum Value

Typical Value

Maximum Value

Unit

Ta

Working temperature

-40

-

105

VBAT

Power supply voltage

3.0

3.3

3.6

V

VIL

I/O low-level input

-0.3

-

VCC*0.25

V

VIH

I/O high-level input

VCC*0.75

-

VCC

V

VOL

I/O low-level output

-

-

VCC*0.1

V

VoH

I/O high-level output

VCC*0.8

-

VCC

V

Imax

I/O drive current

-

-

12

mA

Current consumption during constant transmission and receiving

Working Status

Mode

Rate

TX Power/ Receiving

Typical Value

Maximum Value

Unit

TX

11b

11Mbps

+17dBm

295

354

mA

TX

11g

54Mbps

+13.5dBm

266

300

mA

TX

11n

MCS7

+13dBm

260

290

mA

RX

11b

11Mbps

Constant receiving

98

100

mA

RX

11g

54Mbps

Constant receiving

98

100

mA

RX

11n

MCS7

Constant receiving

98

100

mA

Working Current

Working Mode

Working Status (Ta = 25°C)

Average Value

Maximum Value

Unit

EZ

The module is in EZ mode, and the Wi-Fi indicator blinks quickly.

95

402

mA

AP

The module is in AP mode, and the Wi-Fi indicator blinks slowly.

106

386

mA

Connected

The module is connected to the network, and the Wi-Fi indicator is steady on.

55

132

mA

Disconnected

The module is disconnected from the network, and the Wi-Fi indicator is steady off.

38

206

mA

RF Features

Basic RF Features

Parameter

Description

Frequency band

2.412~2.484GHz

Wi-Fi standard

IEEE 802.11b/g/n(channels1-14)

Data transmission rate

11b:1,2,5.5, 11 (Mbps); 11g:6,9,12,18,24,36,48,54(Mbps); 11n: HT20 MCS07; HT40 MCS07

Antenna type

PCB antenna with a gain of 1.2 dBi

TX Performance

Performance during constant transmission

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

Average RF output power,802.11b CCK Mode 11M

-

16

-

dBm

Average RF output power,802.11g OFDM Mode 54M

-

14

-

dBm

Average RF output power,802.11n OFDM Mode MCS7

-

12

-

dBm

Frequency error

-10

-

10

ppm

RX Performance

RX sensitivity

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

PER<8%,RX sensitivity,802.11b DSSS Mode 11M

-

-85

-

dBm

PER<10%,RX sensitivity,802.11g OFDM Mode 54M

-

-72

-

dBm

PER<10%,RX sensitivity,802.11n OFDM Mode MCS7

-

-68

-

dBm

Antenna Information

Antenna Type

WB3L uses an onboard PCB antenna.

Antenna Interference Reduction

Packaging Information and Production Instructions

Mechanical Dimensions

The PCB dimensions (W x L x H) are 16±0.35mm (W)×24±0.35mm (L) ×2.8±0.15mm (H)。

Side view

WB3L can be mounted onto a PCB by using an SMT placement machine or through-hole mounted onto the PCB through a pin header.

Production Instructions

  1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. A.SMT placement equipment: a)Reflow soldering machine; b)Automated optical inspection (AOI) equipment; c)Nozzle with a 6 mm to 8 mm diameter; B. Baking equipment: a)Cabinet oven; b)Anti-static heat-resistant trays; c)Anti-static heat-resistant gloves;

  2. Bake a module based on HIC status as follows when you unpack the module package: A.If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. B. If the 30% circle is pink, bake the module for 4 consecutive hours. C.If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. D.If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

  3. Baking settings: A.Baking temperature:125±5℃; B.Alarm temperature:130℃; C.SMT placement ready temperature after natural cooling: < 36°C; D.Number of drying times: 1; E.Rebaking condition: The module is not soldered within 12 hours after baking. 5.Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

  4. Before SMT placement, take electrostatic discharge (ESD) protective measures.

  5. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

Storage Conditions

MOQ and Packing Information

Product Model

MOQ(pcs)

Packing Method

Number of Modules in Each Reel Pack

Number of Reel Packs in Each Box

WB3L

4000

Carrier tape and reel packing

1000

4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

—Reorient or relocate the receiving antenna. —Increase the separation between the equipment and receiver. —Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

Important Note

This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

This device have got a FCC ID:2ANDL-WB3L.The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB3L”

This device is intended only for OEM integrators under the following conditions:

1)The antenna must be installed such that 20cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead,it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.

WBLC5 Module Datasheet

Product Overview

WBLC5 is a low-power embedded Wi-Fi and BLE module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions. WB3L is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals. WBLC5 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC andTCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor

  • Dominant frequency: 120 MHz

  • Working voltage: 3.0 V to 3.6 V

  • Peripherals: 3 GPIOs

  • Wi-Fi connectivity

    • 802.11 b/g/n

    • Channels 1 to 14 at 2.4 GHz

    • WPA and WPA2 security modes

    • Up to +17 dBm output power in 802.11b mode

    • STA, AP, and STA+AP working modes

    • EZ and AP net pairing modes for Android and iOS devices

    • Monopole antenna with a gain of 4.6 dBi

    • Working temperature: –40°C to +105°C

  • BLE connectivity

    • Support for Bluetooth 4.0

    • Maximum output power of +6 dBm

    • Monopole antenna with a gain of 4.6 dBi

Applications

  • Intelligent building

  • Smart household and home appliances

  • Smart socket and light

  • Industrial wireless control

  • Baby monitor

  • Network camera

  • Intelligent bus

Change History

No.

Date

Change Description

Version After Change

1

2019-11-07

This is the first release.

V1.0.0

2

2019-12-10

Modifying typesetting.

V1.0.1

3

2019-12-24

Update BLE related materials

V1.0.2

Module Interfaces

Dimensions and Footprint

WB3L has two rows of pins with a 2±0.1 mm pin spacing. The WB3L dimensions (W x L x H) are 8.5±0.35mm (W)×12.7±0.35mm (L) ×1±0.15mm (H)。

Interface Pin Definition

Pin No.

Symbol

I/O Type

Function

1

ANT

O

External antenna pad pin

2

GND

P

Ground pin

3

PWM4

I/O

Hardware PWM pin, which is connected to the P24 pin on the internal IC

4

PWM5

I/O

Hardware PWM pin, which is connected to the P26 pin on the internal IC

5

PWM0

I/O

Hardware PWM pin, which is connected to the P6 pin on the internal IC

6

VCC

P

Power supply pin (3.3 V)

Note:P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.

Test Pin Definition

Pin No.

Symbol

I/O Type

Function

TP1

TP1

I/O

RF Test Pin

Note:The test pin is not recommended to use.

Electrical Parameters

Absolute Electrical Parameters

Parameter

Description

Minimum Value

Maximum Value

Unit

Ts

Storage temperature

-20

105

VBAT

Power supply voltage

3.0

3.6

V

Static electricity voltage (human body model)

TAMB-25℃

-

2

KV

Static electricity voltage (machine model)

TAMB-25℃

-

0.5

KV

Working Conditions

Parameter

Description

Minimum Value

Typical Value

Maximum Value

Unit

Ta

Working temperature

-40

-

105

VBAT

Power supply voltage

3.0

3.3

3.6

V

VIL

I/O low-level input

-0.3

-

VCC*0.25

V

VIH

I/O high-level input

VCC*0.75

-

VCC

V

VOL

I/O low-level output

-

-

VCC*0.1

V

VoH

I/O high-level output

VCC*0.8

-

VCC

V

Imax

I/O drive current

-

-

12

mA

Current consumption during constant transmission and receiving

Working Status

Mode

Rate

TX Power/ Receiving

Typical Value

Maximum Value

Unit

TX

11b

11Mbps

+17dBm

292

354

mA

TX

11g

54Mbps

+13.5dBm

256

307

mA

TX

11n

MCS7

+13dBm

257

286

mA

RX

11b

11Mbps

Constant receiving

95

102

mA

RX

11g

54Mbps

Constant receiving

98

100

mA

RX

11n

MCS7

Constant receiving

98

100

mA

Working Current

Working Mode

Working Status (Ta = 25°C)

Average Value

Maximum Value

Unit

EZ

The module is in EZ mode, and the Wi-Fi indicator blinks quickly.

106

386

mA

AP

The module is in AP mode, and the Wi-Fi indicator blinks slowly.

98

405

mA

Connected

The module is connected to the network, and the Wi-Fi indicator is steady on.

58

138

mA

Disconnected

The module is disconnected from the network, and the Wi-Fi indicator is steady off.

40

210

mA

RF Features

Basic RF Features

Parameter

Description

Frequency band

2.412~2.484GHz

Wi-Fi standard

IEEE 802.11b/g/n(channels1-14)

Data transmission rate

11b:1,2,5.5, 11 (Mbps); 11g:6,9,12,18,24,36,48,54(Mbps); 11n: HT20 MCS07; HT40 MCS07

Antenna type

Monopole antenna with a gain of 1.1 dBi

TX Performance

Performance during constant transmission

Parameter

Minimum Value

Typical Value

Maximum Value

Unit

Average RF output power,802.11b CCK Mode 11M

-

16

-

dBm