Sub-G Module

SS3L Module Datasheet

Product Overview

SS3L is a low-power embedded sub-GHz 434 MHz communications module that Tuya has developed. It consists of a highly integrated RF chip (EFR32FG14P231F256IM32-B) and several peripheral components, with an embedded network protocol stack and robust library functions. SS3L is embedded with a low-power 32-bit CPU, 32 KB random-access memory (RAM), 256 KB flash memory, and extensive peripherals. You can develop embedded sub-GHz communications products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor

  • Clock rate: 40 MHz

• Working voltage: 3.0 V to 3.6 V

• Peripherals: 13 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 analog to digital converter (ADC)

• Sub-GHz connectivity

  • 434 MHz working frequency

  • 50 kbit/s transmission rate, and frequency-shift keying (FSK) modulation

  • +14 dBm or +20 dBm output power

  • External antenna connected through an I-PEX connector

  • Working temperature: –40°C to +105°C

Application Scenarios

• Intelligent building

• Smart household and home appliances

• Smart socket and light

• Industrial wireless control

• Baby monitor

• Network camera

• Intelligent bus

Change History

No.	Date	Change Description	Version After Change
1	2019-08-20	This is the first release.	1.0.0
2	2019-09-16	Updated the document.	2.0.0

Module Interfaces

Dimensions and Footprint

SS3L has three rows of pins with a 2 mm pin spacing. The SS3L dimensions (H x W x D) are 3.3±0.1 mm x 24±0.35 mm x 16±0.35 mm.

Interface Pin Definition

Pin No.	Symbol	I/O Type	Function
1	RST	I/O	Hardware reset pin, which is active at a low level and has been connected to a pull-up resistor
2	ADC	AI	ADC pin
3	EN	I/O	NC pin
4	PB11	I/O	Interrupt pin, which is connected to PB11 (pin 19) on the internal IC
5	PB12	I/O	Hardware PWM pin, which is connected to PB12 (pin 20) on the internal IC
6	PB13	I/O	Hardware PWM pin, which is connected to PB13 (pin 21) on the internal IC
7	PB14	I/O	Hardware PWM pin, which is connected to PB14 (pin 23) on the internal IC
8	3V3	P	Power supply pin (3.3 V)
9	PD14	I/O	Common GPIO pin, which is connected to PD14 (pin 15) on the internal IC
10	NC	I/O	NC pin
11	GND	P	Power supply reference ground pin
12	SWO	I/O	SWO pin, which is used for SWD debugging
13	IO	I/O	SWDIO pin, which is used for SWD debugging
14	CLK	I/O	SWCLK pin, which is used for SWD debugging
15	GND	P	Power supply reference ground pin
16	PD13	I/O	Common GPIO pin, which is connected to PD13 (pin 14) on the internal IC
17	PF3	I/O	Common GPIO pin, which is connected to PF3 (pin 4) on the internal IC
18	PC10	I/O	Common GPIO pin, which is connected to PC10 (pin 31) on the internal IC
19	PC11	I/O	Hardware PWM pin, which is connected to PC11 (pin 32) on the internal IC
20	PB15	I/O	Hardware PWM pin, which is connected to PB15 (pin 24) on the internal IC
21	RX	I/O	UART0_RXD pin
22	TX	I/O	UART0_TXD pin

Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.

Test Pin Definition

Pin No.	Symbol	I/O Type	Function
N/A	TEST	I/O	Used for the module product test.

Note: Test pins are not recommended.

Electrical Parameters

Absolute Electrical Parameters

Parameter	Description	Minimum Value	Maximum Value	Unit
Ts	Storage temperature	–40	125	°C
VBAT	Power supply voltage	1.8	3.8	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	2	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Working Conditions

Parameter	Description	Minimum Value	Typical Value	Maximum Value	Unit
Ta	Working temperature	–20	N/A	105	°C
VBAT	Power supply voltage	2.1	3.3	3.6	V
VIL	I/O low-level input	–0.3	N/A	VCC x 0.3	V
VIH	I/O high-level input	VCC x 0.75	N/A	VCC	V
VOL	I/O low-level output	N/A	N/A	VCC x 0.1	V
VOH	I/O high-level output	VCC x 0.8	N/A	VCC	V
Imax	I/O drive current	N/A	N/A	12	mA

Current Consumption

Working Status	Mode	Rate	TX Power/RX	Average Value	Maximum Value (Typical Value)	Unit
TX	FSK	50 kbit/s	+14 dBm	100	111	mA
RX	FSK	50 kbit/s	–107 dBm	7	17	mA
Low power monitoring	1s period 1ms jump	/	/	<12	/	uA
Low power node	Interrupt the wake - up process（3s)	/	/	1.92	/	mA

Working Current

Working Mode	Working Status (Ta = 25°C)	Average Value	Maximum Value (Typical Value)	Unit
EZ	The module is in EZ mode.	4.7	13	mA
Connected	The module is connected to the network.	7	17	mA
Disconnected	The module is disconnected from the network.	4	13	mA

RF Features

Basic RF Features

Parameter	Description
Working frequency	433.05 MHz to 434.79 MHz
Physical layer standard	IEEE 802.15.4g/c
Data transmission rate	150 kbit/s
Antenna type	IPEX

TX Performance

Continuous TX performance |Parameter |Minimum Value |Typical Value |Maximum Value |Unit| |--------|---------|---------|----------|-----| |Average RF output power|N/A |14| N/A |dBm |Frequency error |–10| N/A |+10| ppm

RX Performance

RX sensitivity |Parameter |Minimum Value |Typical Value |Maximum Value |Unit| |---------|-------|---------|-------|-------| |RX sensitivity|N/A|–107 |N/A |dBm

Antenna Information

Antenna Type

SS3L uses a spring antenna or an external antenna. By default, SS3L uses an external antenna with an I-PEX connector.

Antenna Interference Reduction

To ensure optimal performance when the module uses a spring antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

Antenna Connector Specifications

SS3L Module Datasheet

Packaging Information and Production Instructions

Mechanical Dimensions

The PCB dimensions (H x W x D) are 1.0±0.1 mm x 24±0.35 mm x 16±0.35 mm.

Side View

SS3L Module Datasheet

Pin Connections

SS3L Module Datasheet

Production Instructions

1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB. (1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter (2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves

2. Storage conditions for a delivered module are as follows: (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%. (2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed. (3) The package contains a humidity indicator card (HIC).
3. Bake a module based on HIC status as follows when you unpack the module package: (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours. (2) If the 30% circle is pink, bake the module for 4 consecutive hours. (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours. (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.

4. Baking settings: (1) Baking temperature: 125±5°C (2) Alarm temperature: 130°C (3) SMT placement ready temperature after natural cooling: < 36°C (4) Number of drying times: 1 (5) Rebaking condition: The module is not soldered within 12 hours after baking.

5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

   Recommended Oven Temperature Curve

   Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.

   Storage Conditions

   

   MOQ and Packing Information

Product Model	MOQ	Packing Method	Number of Modules in Each Reel Pack	Number of Reel Packs in Each Box
SS3L	4000	Carrier tape and reel packing	1000	4

Appendix: Statement

Declaration of Conformity European Notice

SS3L Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

SS3L Module Datasheet

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.