# Sub-G Module

## SS3L Module Datasheet

### Product Overview <a href="#title-0-product-20overview" id="title-0-product-20overview"></a>

SS3L is a low-power embedded sub-GHz 434 MHz communications module that Tuya has developed. It consists of a highly integrated RF chip (EFR32FG14P231F256IM32-B) and several peripheral components, with an embedded network protocol stack and robust library functions. SS3L is embedded with a low-power 32-bit CPU, 32 KB random-access memory (RAM), 256 KB flash memory, and extensive peripherals. You can develop embedded sub-GHz communications products as required.

#### Features <a href="#title-1-features" id="title-1-features"></a>

* Embedded low-power 32-bit CPU, which can also function as an application processor
  * Clock rate: 40 MHz
* Working voltage: 3.0 V to 3.6 V
* Peripherals: 13 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 analog to digital converter (ADC)
* Sub-GHz connectivity
  * 434 MHz working frequency
  * 50 kbit/s transmission rate, and frequency-shift keying (FSK) modulation
  * +14 dBm or +20 dBm output power
  * External antenna connected through an I-PEX connector
  * Working temperature: –40°C to +105°C

#### Application Scenarios <a href="#title-2-application-20scenarios" id="title-2-application-20scenarios"></a>

* Intelligent building
* Smart household and home appliances
* Smart socket and light
* Industrial wireless control
* Baby monitor
* Network camera
* Intelligent bus

#### Change History <a href="#title-3-change-20history" id="title-3-change-20history"></a>

| **No.** | **Date**   | **Change Description**     | **Version After Change** |
| ------- | ---------- | -------------------------- | ------------------------ |
| 1       | 2019-08-20 | This is the first release. | 1.0.0                    |
| 2       | 2019-09-16 | Updated the document.      | 2.0.0                    |

### Module Interfaces <a href="#title-4-module-20interfaces" id="title-4-module-20interfaces"></a>

#### Dimensions and Footprint <a href="#title-5-dimensions-20and-20footprint" id="title-5-dimensions-20and-20footprint"></a>

SS3L has three rows of pins with a 2 mm pin spacing. The SS3L dimensions (H x W x D) are 3.3±0.1 mm x 24±0.35 mm x 16±0.35 mm.\
![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200109/0ef18d704f2d4b298d74c6e7e8a32a19.png)

#### Interface Pin Definition <a href="#title-6-interface-20pin-20definition" id="title-6-interface-20pin-20definition"></a>

| **Pin No.** | **Symbol** | **I/O Type** | **Function**                                                                                    |
| ----------- | ---------- | ------------ | ----------------------------------------------------------------------------------------------- |
| 1           | RST        | I/O          | Hardware reset pin, which is active at a low level and has been connected to a pull-up resistor |
| 2           | ADC        | AI           | ADC pin                                                                                         |
| 3           | EN         | I/O          | NC pin                                                                                          |
| 4           | PB11       | I/O          | Interrupt pin, which is connected to PB11 (pin 19) on the internal IC                           |
| 5           | PB12       | I/O          | Hardware PWM pin, which is connected to PB12 (pin 20) on the internal IC                        |
| 6           | PB13       | I/O          | Hardware PWM pin, which is connected to PB13 (pin 21) on the internal IC                        |
| 7           | PB14       | I/O          | Hardware PWM pin, which is connected to PB14 (pin 23) on the internal IC                        |
| 8           | 3V3        | P            | Power supply pin (3.3 V)                                                                        |
| 9           | PD14       | I/O          | Common GPIO pin, which is connected to PD14 (pin 15) on the internal IC                         |
| 10          | NC         | I/O          | NC pin                                                                                          |
| 11          | GND        | P            | Power supply reference ground pin                                                               |
| 12          | SWO        | I/O          | SWO pin, which is used for SWD debugging                                                        |
| 13          | IO         | I/O          | SWDIO pin, which is used for SWD debugging                                                      |
| 14          | CLK        | I/O          | SWCLK pin, which is used for SWD debugging                                                      |
| 15          | GND        | P            | Power supply reference ground pin                                                               |
| 16          | PD13       | I/O          | Common GPIO pin, which is connected to PD13 (pin 14) on the internal IC                         |
| 17          | PF3        | I/O          | Common GPIO pin, which is connected to PF3 (pin 4) on the internal IC                           |
| 18          | PC10       | I/O          | Common GPIO pin, which is connected to PC10 (pin 31) on the internal IC                         |
| 19          | PC11       | I/O          | Hardware PWM pin, which is connected to PC11 (pin 32) on the internal IC                        |
| 20          | PB15       | I/O          | Hardware PWM pin, which is connected to PB15 (pin 24) on the internal IC                        |
| 21          | RX         | I/O          | UART0\_RXD pin                                                                                  |
| 22          | TX         | I/O          | UART0\_TXD pin                                                                                  |

> Note: **P** indicates a power supply pin, **I/O** indicates an input/output pin, and **AI** indicates an analog input pin.

#### Test Pin Definition <a href="#title-7-test-20pin-20definition" id="title-7-test-20pin-20definition"></a>

| **Pin No.** | **Symbol** | **I/O Type** | **Function**                      |
| ----------- | ---------- | ------------ | --------------------------------- |
| N/A         | TEST       | I/O          | Used for the module product test. |

> Note: Test pins are not recommended.

### Electrical Parameters <a href="#title-8-electrical-20parameters" id="title-8-electrical-20parameters"></a>

#### Absolute Electrical Parameters <a href="#title-9-absolute-20electrical-20parameters" id="title-9-absolute-20electrical-20parameters"></a>

| **Parameter**                                 | **Description**      | **Minimum Value** | **Maximum Value** | **Unit** |
| --------------------------------------------- | -------------------- | ----------------- | ----------------- | -------- |
| Ts                                            | Storage temperature  | –40               | 125               | °C       |
| VBAT                                          | Power supply voltage | 1.8               | 3.8               | V        |
| Static electricity voltage (human body model) | Tamb = 25°C          | N/A               | 2                 | kV       |
| Static electricity voltage (machine model)    | Tamb = 25°C          | N/A               | 0.5               | kV       |

#### Working Conditions <a href="#title-10-working-20conditions" id="title-10-working-20conditions"></a>

| **Parameter** | **Description**       | **Minimum Value** | **Typical Value** | **Maximum Value** | **Unit** |
| ------------- | --------------------- | ----------------- | ----------------- | ----------------- | -------- |
| Ta            | Working temperature   | –20               | N/A               | 105               | °C       |
| VBAT          | Power supply voltage  | 2.1               | 3.3               | 3.6               | V        |
| VIL           | I/O low-level input   | –0.3              | N/A               | VCC x 0.3         | V        |
| VIH           | I/O high-level input  | VCC x 0.75        | N/A               | VCC               | V        |
| VOL           | I/O low-level output  | N/A               | N/A               | VCC x 0.1         | V        |
| VOH           | I/O high-level output | VCC x 0.8         | N/A               | VCC               | V        |
| Imax          | I/O drive current     | N/A               | N/A               | 12                | mA       |

#### Current Consumption <a href="#title-11-current-20consumption" id="title-11-current-20consumption"></a>

| **Working Status**   | **Mode**                            | **Rate**  | **TX Power/RX** | **Average Value** | **Maximum Value (Typical Value)** | **Unit** |
| -------------------- | ----------------------------------- | --------- | --------------- | ----------------- | --------------------------------- | -------- |
| TX                   | FSK                                 | 50 kbit/s | +14 dBm         | 100               | 111                               | mA       |
| RX                   | FSK                                 | 50 kbit/s | –107 dBm        | 7                 | 17                                | mA       |
| Low power monitoring | 1s period 1ms jump                  | /         | /               | <12               | /                                 | uA       |
| Low power node       | Interrupt the wake - up process（3s) | /         | /               | 1.92              | /                                 | mA       |

#### Working Current <a href="#title-12-working-20current" id="title-12-working-20current"></a>

| **Working Mode** | **Working Status (Ta = 25°C)**               | **Average Value** | **Maximum Value (Typical Value)** | **Unit** |
| ---------------- | -------------------------------------------- | ----------------- | --------------------------------- | -------- |
| EZ               | The module is in EZ mode.                    | 4.7               | 13                                | mA       |
| Connected        | The module is connected to the network.      | 7                 | 17                                | mA       |
| Disconnected     | The module is disconnected from the network. | 4                 | 13                                | mA       |

### RF Features <a href="#title-13-rf-20features" id="title-13-rf-20features"></a>

#### Basic RF Features <a href="#title-14-basic-20rf-20features" id="title-14-basic-20rf-20features"></a>

| **Parameter**           | **Description**          |
| ----------------------- | ------------------------ |
| Working frequency       | 433.05 MHz to 434.79 MHz |
| Physical layer standard | IEEE 802.15.4g/c         |
| Data transmission rate  | 150 kbit/s               |
| Antenna type            | IPEX                     |

#### TX Performance <a href="#title-15-tx-20performance" id="title-15-tx-20performance"></a>

Continuous TX performance |**Parameter** |**Minimum Value** |**Typical Value** |**Maximum Value** |**Unit**| |--------|---------|---------|----------|-----| |Average RF output power|N/A |14| N/A |dBm |Frequency error |–10| N/A |+10| ppm

#### RX Performance <a href="#title-16-rx-20performance" id="title-16-rx-20performance"></a>

RX sensitivity |**Parameter** |**Minimum Value** |**Typical Value** |**Maximum Value** |**Unit**| |---------|-------|---------|-------|-------| |RX sensitivity|N/A|–107 |N/A |dBm

### Antenna Information <a href="#title-17-antenna-20information" id="title-17-antenna-20information"></a>

#### Antenna Type <a href="#title-18-antenna-20type" id="title-18-antenna-20type"></a>

SS3L uses a spring antenna or an external antenna. By default, SS3L uses an external antenna with an I-PEX connector.

#### Antenna Interference Reduction <a href="#title-19-antenna-20interference-20reduction" id="title-19-antenna-20interference-20reduction"></a>

To ensure optimal performance when the module uses a spring antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

#### Antenna Connector Specifications <a href="#title-20-antenna-20connector-20specifications" id="title-20-antenna-20connector-20specifications"></a>

![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200109/3da79d790d464f699cee27eb198e8ba1.png)

### Packaging Information and Production Instructions <a href="#title-21-packaging-20information-20and-20production-20instructions" id="title-21-packaging-20information-20and-20production-20instructions"></a>

#### Mechanical Dimensions <a href="#title-22-mechanical-20dimensions" id="title-22-mechanical-20dimensions"></a>

The PCB dimensions (H x W x D) are 1.0±0.1 mm x 24±0.35 mm x 16±0.35 mm.![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200109/a1cf8dddd1fb4e29bd1a35ea84497db8.png)

#### Side View <a href="#title-23-side-20view" id="title-23-side-20view"></a>

![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200109/6539d14ddd4e425295ed9a2b6eccc949.png)

#### Pin Connections <a href="#title-24-pin-20connections" id="title-24-pin-20connections"></a>

![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200303/76b2f1e7dc434f34be5a6afbb92e9f69.png)

#### Production Instructions <a href="#title-25-production-20instructions" id="title-25-production-20instructions"></a>

1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.\
   (1) SMT placement equipment\
   i. Reflow soldering machine\
   ii. Automated optical inspection (AOI) equipment\
   iii. Nozzle with a 6 mm to 8 mm diameter\
   (2) Baking equipment\
   i. Cabinet oven\
   ii. Anti-static heat-resistant trays\
   iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:\
   (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.\
   (2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.\
   (3) The package contains a humidity indicator card (HIC).\
   ![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20191209/e855f5c64c74448cb901bc660e18e4c6.png)
3. Bake a module based on HIC status as follows when you unpack the module package:\
   (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.\
   (2) If the 30% circle is pink, bake the module for 4 consecutive hours.\
   (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.\
   (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
4. Baking settings:\
   (1) Baking temperature: 125±5°C\
   (2) Alarm temperature: 130°C\
   (3) SMT placement ready temperature after natural cooling: < 36°C\
   (4) Number of drying times: 1\
   (5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

   **Recommended Oven Temperature Curve**

   Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.\
   ![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20191209/1a1a1b97a1ec488dbf9480f88311e9b1.png)

   **Storage Conditions**

   ![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20191209/d792eb5ea19646d48a3a219bc49662d0.png)

   **MOQ and Packing Information**

| **Product Model** | **MOQ** | **Packing Method**            | **Number of Modules in Each Reel Pack** | **Number of Reel Packs in Each Box** |
| ----------------- | ------- | ----------------------------- | --------------------------------------- | ------------------------------------ |
| SS3L              | 4000    | Carrier tape and reel packing | 1000                                    | 4                                    |

### Appendix: Statement <a href="#title-29-appendix-3a-20statement" id="title-29-appendix-3a-20statement"></a>

Declaration of Conformity European Notice

![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200107/b9d02ed6d1b7477d8c87b6ce012fc4b9.png)

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of Conformity can be found at <https://www.tuya.com>.

![SS3L  Module Datasheet](https://airtake-public-data.oss-cn-hangzhou.aliyuncs.com/goat/20200107/25b18f04cecd484db93c67930377b26d.png)

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.